Bare die, Wire bonding, Chip on Board (CoB), Chip on Chip (CoC), Flip Chip (FC), SMD, BGA, MCM, CSP, 3D CB, and 3D Die stacking are technologies which enable significant size reductions over conventional technologies.
With its automatic SMT production lines in Europe, North Africa and the U.S.A., Valtronic is an EMS with state of the art manufacturing facilities and extended services including box-builds, final tests, and end-user packaging.
Located in the Swiss watch valley, Valtronic’s seasoned team performs high precision assemblies with a know-how extended to all of Valtronic’s facilities. The facility in Morocco moreover allows for assemblies at very competitive prices.
Our experts work with your objectives in mind, which results in customized solutions with