Scope of Expertise
Combining several assembly and packaging technologies, Valtronic helps you meet the challenge of integrating more functionalities into always thinner and smaller devices.
From feasibility study and R&D to industrialization and manufacturing, Valtronic provides complete turnkey manufacturing solutions for Class I, Class II and Class III medical devices.
Bare die, Wire bonding, Chip on Board (CoB), Chip on Chip (CoC), Flip Chip (FC), SMD, BGA, MCM, CSP, 3D CB, and 3D Die stacking are technologies which enable significant size reductions over conventional technologies.
With its automatic SMT production lines in Europe, North Africa and the U.S.A., Valtronic is an EMS with state of the art manufacturing facilities and extended services including box-builds, final tests, and end-user packaging.
Located in the Swiss watch valley, Valtronic’s seasoned team performs high precision assemblies with a know-how extended to all of Valtronic’s facilities. The facility in Morocco moreover allows for assemblies at very competitive prices.
Main Markets Served
News & Events
4 ways to optimize New Product Introduction with your Electronic Contract Manufacturer
Selecting a Contract Manufacturer (CM) is a well thought and [...]
Valtronic Adds Two New Juki Machines to Meet Growth Demands
Cleveland, OH March 2019 - Valtronic, an EMS manufacturer focusing [...]
New SPI and AOI Machines at our site in Solon, USA
In Valtronic’s continuing efforts to improve our manufacturing processes and [...]