Valtronic’s facilities are equipped with first-rate SMT and microelectronics technologies to address all your assembly needs for innovative medical devices.
Our capabilities include:
Printed Circuit Board Assembly
- Multi-layer / High Density Interconnect (HDI) PCBs
- Flex & rigid flex
Combined Assembly Technologies
- SMT, mini SMT (008004)
- CoB (Chip on Board)
- FC (Flip-Chip)
- BGA with multi-die
- CoC (Chip on chip)
- CSP (Chip Scale Package)
- MCM (Multi-Component Modules)
- THT (Through-Hole Technology)
- Board wash
Our seasoned manual assembly technicians have been developing their skills for over thirty years. They assemble your most challenging parts with discipline and goldsmith’s precision. This proficiency, originating from the Swiss watch valley, has been extended to all of the Valtronic sites. Additionally, your product costs can be optimized through partial or full assembly of your device in Valtronic’s Moroccan facility.
Clean Room Assembly
All of our manufacturing facilities are equipped with clean rooms which are ISO 5 and 7 certified. Our customers benefit from a dedicated clean room area for the assembly of highly sensitive devices such as Class III implants.