Innovative Assembly Processes

Valtronic’s facilities are equipped with first-rate SMT and microelectronics technologies to address all your assembly needs for innovative industrial, medical and diagnostics devices.

Our capabilities include:

Printed Circuit Board / Substrates

  • Multi-layer / High Density Interconnect (HDI) PCBs
  • Rigid, Flex & Rigid-Flex
  • Copper Tracks down to 15 microns
  • Thickness : min. 25 microns
  • Pitch: min. 30 microns (Copper Pillar)

Combined Assembly Technologies

  • SMT, micro SMT (008004)
  • CoB (Chip on Board)
  • FC (Flip-Chip)
  • BGA with multi-die
  • CoC (Chip on chip)
  • CSP (Chip Scale Package)
  • MCM (Multi-Component Modules)
  • Board wash
  • Soldered Flip-Chip of micro BGA
  • Conformal Coating Automatic Dispensing
  • Underfill Automatic Dispensing

Manual Assembly

Our manual assembly technicians have been developing their skills for over fourty years. They assemble your most challenging parts with discipline and goldsmith’s precision. This proficiency, originating from the Swiss watch valley, has been extended to all of the Valtronic sites. Additionally, your product costs can be optimized through partial or full assembly of your device in Valtronic’s Moroccan facility.

Clean Room Assembly

Our manufacturing facilities are equipped with clean rooms compliant  to the ISO 5 and 7. Our customers benefit from a dedicated clean room area for the assembly of highly sensitive devices such as Class III implants.

Design for Manufacturing

With our expertise, we are able to develop PCBs while anticipating the production process and considering all possible obstacles related to mass production.

Innovative Assembly Processes

Valtronic’s facilities are equipped with first-rate SMT and microelectronics technologies to address all your assembly needs for innovative industrial, medical and diagnostics devices.

Our capabilities include:

Printed Circuit Board Assembly 

  • Multi-layer / High Density Interconnect (HDI) PCBs
  • Rigid, Flex & Rigid-Flex
  • Copper Tracks down to 15 microns
  • Thickness : min. 25 microns
  • Pitch: min. 30 microns (Copper Pillar)

Combined Assembly Technologies

  • SMT, micro SMT (008004)
  • CoB (Chip on Board)
  • FC (Flip-Chip)
  • BGA with multi-die
  • CoC (Chip on chip)
  • CSP (Chip Scale Package)
  • MCM (Multi-Component Modules)
  • Board wash
  • Soldered Flip-Chip of micro BGA
  • Conformal Coating Automatic Dispensing
  • Underfill Automatic Dispensing

Manual Assembly

Our team of manual assembly technicians have been developing their skills for over thirty years. They assemble your most challenging parts with discipline and goldsmith’s precision. This expertise, originating from the Swiss watch valley, has been extended to all Valtronic locations. Moreover, your product costs can be optimized through partial or full assembly of your device in Valtronic’s Moroccan facility.

Clean Room Assembly

Our manufacturing facilities are equipped with clean rooms compliant  to the ISO 5 and 7. Our customers benefit from a dedicated clean room area for the assembly of highly sensitive devices such as Class III implants.

Design for Manufacturing

With our expertise, we are able to develop PCBs while anticipating the production process and considering all possible obstacles related to mass production.

Your Benefits

Complex PCBAs

Engineering support for customized PCBs

Including Flex

Hybrid Assemblies

with state of the art equipment

High Precision Manual Assembly

For placement of extremely delicate components

Customized Packaging

with full encapsulation